Infrastructure for Rapid Assessment of Reliability: Infrastructure and process improvements in the reliability testing of a high density microelectronic packaging technology

When:
April 14, 2016 @ 5:30 pm – April 14, 2016 @ 8:00 pm America/New York Timezone
2016-04-14T17:30:00-04:00
2016-04-14T20:00:00-04:00
Where:
City: Lexington
Contact:
MAILTO:charles.recchia@ieee.org

Infrastructure for Rapid Assessment of Reliability: Infrastructure and process improvements in the reliability testing of a high density microelectronic packaging technology

Hannah Varner, Draper Laboratory

 

Draper Laboratory has developed a high density microelectronics packaging technology called iUHD (integrated Ultra High Density)[1] based on a foundation of Multi-Chip Module technology combined with automated silicon fabrication techniques. As part of the technology development, we needed a means to efficiently characterize the environmental reliability of fabricated features in order to quickly evaluate new materials and processes. In response we have developed an infrastructure for accelerated life testing of features and process variations. We started by conducting a Failure Modes and Effects Analysis to focus our efforts on the most critical aspects of the technology given customer environmental qualification requirements. Then we developed test structures for high risk priority numbers. Each test structure is designed and with one feature so we are able to tailor the life testing for the relevant failure mechanisms, and ensure test results are straightforward to interpret. We used a common test die format, common package and common test interface board. This common infrastructure makes it feasible to evaluate a large number of different test structures with a limited amount of resources. The common infrastructure also makes the testing method extensible to new structures as the technology evolves.

We have completed an initial assessment, and confirmed the expected environmental robustness of Draper’s iUHD technology. We have also leveraged this infrastructure to quickly characterize a new via process, and are using the test structures to evaluate changes to our metallization process and geometries. Along the way, we improved upon some shortcomings identified in our first set of test die.

This paper will describe the infrastructure we have developed including generic test die, as well as report on our initial results, improvements and future directions.

 

Speaker(s): Hannah Varner,

Agenda:

5:30-6:00 Sign In, Networking, Light Dinner & Refreshments

6:00-6:10 Chapter Chair Greetings & Announcements

6:10-8:00 Hannah Varner, Draper Laboratory

8:00-8:15 Q&A session, meeting adjourns

Location:
Bldg: MIT Lincoln Laboratory – Forbes Road Location
3 Forbes Rd
Lexington, Massachusetts
02421