2.5D and 3D Heterogeneous Integration Architectures using Dense Electrical, Photonic, and Embedded Cooling technologies for the Next Phase of Moore’s Law

Monolithic ICs have progressed at an unprecedented rate of innovation in the past 60 years. But, with Moore’s Law slowing down, ‘polylithic’ integration of heterogeneous ICs and devices is projected to be a key driver for performance, power, and cost in the next phase of Moore’s Law.
This presentation will first discuss various emerging heterogeneous integration approaches using 2.5D and 3D IC technologies, including those being developed at Georgia Tech’s Integrated 3D Systems Lab. Design considerations and benchmarking of power delivery, signaling, and thermal are also described, including back-side power delivery. Second, a passive self-alignment and assembly approach for optical fibers is demonstrated using a combination of silicon micromachining and 3D printing to achieve sub-micron alignment accuracy to underlying silicon-on-insulator (SOI) substrate with monolithic waveguides and couplers in 2.5D/3D IC platforms enabling unique co-packaged photonics. Lastly, we experimentally demonstrate embedded microfluidic cooling technologies for 2.5D/3D IC architectures with electrical via integration to enable dense 2.5D/3D electronics with no thermal limits. Monolithic microfluidic cooling and benefits using 14 nm 2.5D FPGA are discussed.

Speaker(s): Prof. Muhannad Bakir,

Albany, New York, United States, Virtual: https://events.vtools.ieee.org/m/276503