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25 Years of Advancements in Thermomechanical Reliability: Focus on Interface Strength Characterization in Microelectronic Packaging
March 13 @ 12:30 pm - 2:00 pm
Thermomechanical reliability of semiconductor devices and their packaging represents a crucial aspect for process yield, selection and integration of new materials, and reliability during operation. The adhesion of interfaces and cohesion of layers represents one of the most important metrics for reliability. In this lecture Dr. Dauskardt will describe innovations over the last 25 years to reliably characterize and understand adhesion and related thermomechanical concepts relevant for semiconductor
1) FEOL and BEOL structures.
2) packaging materials and designs.
Speaker(s): Reinhold Dasukardt,
Agenda:
12:30 to 1 pizza lunch
1 to 2 PM presentation
Room: CESTM auditorium, Bldg: CESTM, 257 Fuller Rd, Albany, New York, United States