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Advanced Packaging in Hyperscale Data Center Applications
May 6, 2022 @ 12:00 pm - 1:00 pm
Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing in performance while reducing power per Gbps. Challenges toward device integration, reliability and industry eco-system collaboration will also be elaborated.
Speaker(s): Dr Jie Xue,
Virtual: https://events.vtools.ieee.org/m/311290
