Challenges and Reliability in Automotive Power Electronics Packaging & Overview of Semiconductor devices and reliability

Power electronics is the fastest growing segment. It has obtained wide applications in the electronic industry due to the rapid advances in power IC fabrication and the demands of a growing market in almost all areas of electronic application, particularly in automotive industry HEV/EV green cars. However, due to the intrinsic structural nature, the requirement for automotive power product and its reliability is extremely high. This talk will present the overview of recent advances in power electronic device and packaging, including SiC applications. A review of recent advances in reliability of automotive power electronic packaging and modeling is presented based on the development of power device integration. The talk will cover in more detail of reliability issues and challenges in assembly process and the reliability tests. Along with new automotive power packaging development, the role of modeling is a key to assure successful new technology development. Challenges of automotive power electronic packaging in next generation materials, core technologies and modeling are presented and discussed.

Co-sponsored by: University of South Maine, Gorham, Maine

Speaker(s): Yong Liu, Jifa Hao

Bldg: John Mitchell Center, 67 Campus Avenue, Gorham, Maine, United States, 04038