Electrical Design of Advanced Packaging in Computing Systems

The electrical design of computer systems, which is often called signal integrity and power integrity, is a cross-discipline engineering effort essential to reliable operation of complex systems. This presentation will cover the development of electrical techniques, tools, and methodologies as applied to the design of systems. These concepts have become the fundamentals on which today’s electrical design methodologies are built. Currently, heterogeneous integration driving the advancement of systems and increased integration of special processor cores and accelerators has created a challenge as well as a great opportunity for the electrical packaging engineer. Advancing the existing design practices to include co-design of chips and packages, multi-physics analysis with thermal-electrical analysis is a current focus of academic and industry development to achieve a higher level of integration.

Co-sponsored by: Binghamton University IEEC

Speaker(s): Dr Dale Becker,

Room: Fountain Room, Smart Energy, Bldg: Smart Energy Building, Binghamton University , 85 Murray Hill Road, Vestal , New York, United States, 13850