Fifth Annual Symposium on Heterogeneous Integration

In addition to seven key talks with a global perspective on Wednesday, February 23rd, we have two days of detailed presentations/discussions across the 23 Working Groups to address needed cross-TWG issues in preparation for the next edition of the Roadmap. Talks from packaging experts: — Heterogeneous Integration: A Roadmap to the Next Era of Moore’s Law; — Could We Work on The Demand Side Too … Please?; — The Roaring 20s – A Renaissance for the Semiconductor Industry; — Bridging Chip Design to Applications Through Heterogenous Integration; — Tera-Scale-Integration: Optimized Heterogeneous and Monolithic Integration; — The Future is Heterogeneous Integration; — 3D Heterogeneous Integration (HI): An Enabler for Next Generation Systems; plus panels: — Package Architecture and Co-Design; — SiP and Modules for Automotive Applications. We value your participation and inputs.

Virtual: https://events.vtools.ieee.org/m/303363