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GE/BU/IBM Electronics Packaging Symposium
September 7, 2022 @ 8:00 am - September 9, 2022 @ 5:00 pm
This year’s symposium was organized by Binghamton University, GE Research and IBM. We are having an electronic packaging symposium at Binghamton University on September 7th, and 8th. Detailed information is below.
The agenda is packed and contains timely technical talks and workshops. A highlight of the conference will be our keynote speaker Frank Gayle, Deputy Director of the Office of Advanced Manufacturing at the National Institute of Standards and Technology, and also Deputy Director of the Advanced Manufacturing National Program Office.
The keynote will discuss the unique opportunity to bolster the U.S. integrated circuit and packaging production supply chain. Furthermore, with $11 billion in appropriated funds for both research and development, and education and workforce development, we can prepare for long-term U.S. leadership in microelectronics. This keynote talk will present the opportunities described in the CHIPS ACT legislation and the approach that NIST and the Department of Commerce are taking for implementation
This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:
– Future of Computing for HPC and AI
– mm Wave, 5G and 6G in Packaging
– Power Electronics
– Thermal Challenges / Harsh Environments
– Flexible & Additive Electronics
– Heterogeneous Integration
– Advance Substrates
– Wearable and Flexible Electronics for Medical Applications
Agenda : https://www.binghamton.edu/ieec/eps/agenda.html
This year’s program includes keynotes, 8 sessions with technical presentations, a student poster session with students from local Universities, and exhibits from leading companies.
A special panel titled “Building the North American Ecosystem for Advanced Packaging: What Comes Next” will be held to discuss the state of the Electronics Industry Ecosystem with industry and government leaders.
We will be hosting an update to the Heterogeneous Integration Roadmap and discuss the challenges that we will face in the coming years in advance packaging. We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share one’s expertise, learn, and build partnerships.
General conference Information including speaker info and exhibitor opportunities:
Information on Travel and hotels may be found here:
We hope that you will join us in September.
Room: Symposium Hall, Bldg: Center of Excellence, Binghamton University State University of New York , 85 Murray Hill Road, Vestal , New York, United States, 13850