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Heterogeneous Integration to enable AI Architectures

March 31, 2023 @ 8:00 am - 10:00 am

Abstract:
While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology, especially Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration. We will look at their attributes as well as their challenges, to determine how they can be leveraged to achieve AI architectures.

Speaker(s): Mukta Farooq,

Agenda:
12:00 noon: pizza is served

12:15PM: talk begins

1PM: Q&A, discussion, refreshments

Room: GOL-2400, Bldg: Golisano Hall (Computing), Rochester Institute of Technology, Rochester, New York, United States, 14623

Details

Date:
March 31, 2023
Time:
8:00 am - 10:00 am
Event Category:
Website:
https://events.vtools.ieee.org/m/351803

Organizer

fang_luo@stonybrook_edu
Email
fang_luo@stonybrook_edu
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