3D millimeter-wave imaging and sensing with Si-based phased arrays, edge computing, and AI

The use of millimeter-wave frequencies for 5G networks has been a primary contributor for transitioning Si-based phased array technology from R&D to real-world deployments. While the commercial use of millimeter-wave sensing so far has been dominated by low-cost, compact MIMO radars for automotive and industrial applications, the on-going wide deployment and advancement of Si-based phased arrays opens a new horizon of opportunities for sensing and event recognition. This talk will first cover the fundamentals and KPIs of 3D radar systems using phased arrays including associated key circuit design and packaging design techniques. Examples of such 3D radar systems at 28-GHz, 60-GHz and 94-GHz will be provided. Next, the presentation will describe how the full potential of such systems can be realized through synergistic co-design with algorithms and edge computing assets. Key examples of emerging applications based on these vertically integrated antennas-to-software/AI systems will be provided including multi-spectral imaging, 5G mmWave joint sensing and communications, and AI-based recognition of human gestures and concealed objects. Dr. Valdes-Garcia will provide an overview of ongoing research in these technologies, as well as a roadmap of how future realizations of these applications can benefit from the emerging semiconductor and packaging technologies under development at IBM’s AI Hardware Center, located in the Albany, NY Nanotech Complex. Contact George Blasiak (george.blasiak@hrfmlaw.com) of Syracuse IEEE for more information on the event.

Speaker(s): Alberto Valdes Garcia, Alberto Valdes Garcia

Virtual: https://events.vtools.ieee.org/m/377278