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Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity

August 11 @ 8:15 am - 12:30 pm

Various speakers will give talks on advanced technologies for inter-chiplet connectivity

Speaker(s): Various speakers,

Agenda:
Vineet Pancholi, Sr Director, Test Technology, Amkor Technology, Inc., Topic: Advanced Technologies for Inter- Chiplet Connectivity

Dr. Ning-Cheng Lee , ShinePure Hi-Tech, Topic: Material Considerations for high Reliability Pb-Free Solder Joints

Dr. Tanja Braun, Fraunhofer IZM, Dept. System Integration and Interconnection Technologies, Topic: Advanced Packaging – Key for Heterogeneous Integration

Dr. Junghyun Cho, Professor, SUNY Binghamton, Topic: Bonding Technologies toward Ultra Fine Pitch 3D Interconnection

Bldg: NFS auditorium, 255 Fuller Rd, Albany, New York, United States, 12203-3603

Details

Date:
August 11
Time:
8:15 am - 12:30 pm
Event Category:
Website:
https://events.vtools.ieee.org/m/320609

Organizer

[email protected]_com
Email:
sathya_r@ibm_com
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