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Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity
August 11, 2022 @ 8:15 am - 12:30 pm
Various speakers will give talks on advanced technologies for inter-chiplet connectivity
Speaker(s): Various speakers,
Agenda:
Vineet Pancholi, Sr Director, Test Technology, Amkor Technology, Inc., Topic: Advanced Technologies for Inter- Chiplet Connectivity
Dr. Ning-Cheng Lee , ShinePure Hi-Tech, Topic: Material Considerations for high Reliability Pb-Free Solder Joints
Dr. Tanja Braun, Fraunhofer IZM, Dept. System Integration and Interconnection Technologies, Topic: Advanced Packaging – Key for Heterogeneous Integration
Dr. Junghyun Cho, Professor, SUNY Binghamton, Topic: Bonding Technologies toward Ultra Fine Pitch 3D Interconnection
Bldg: NFS auditorium, 255 Fuller Rd, Albany, New York, United States, 12203-3603
