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Mini Colloquium on Current Trends in Semiconductor Packaging in the NY Region
June 21, 2023 @ 4:45 am - 8:00 am
Mark Poliks- Electronics at the Edge: Flexible, Hybrid and Additive Approaches to Medical and Industrial Devices
Annette Teng- Overview of AIM Photonics Test Assembly and Packaging (TAP) Facility
Sunny Son- Challenges in Fusion Bonding and Hybrid Bonding
Speaker(s): Mark Poliks, Annette Teng, Sunny Son
Bldg: CESTM Auditorium, 257 Fuller Rd, Albany, New York, United States, 12203
