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Non-destructive Inspection Technologies for Pharmaceutical and Medical Packages

March 23, 2017 @ 12:00 pm - 1:00 pm

Co-sponsored by: SP01 and School of Computer Sciences and Engineering, FDU

Non-destructive inspection technologies and systems provide repeatable, reliable results and can be integrated into protocols at any point in the manufacturing process as they are non-destructive, non-subjective and require no sample preparation. This presentation will provide profound understanding of importance of package integrity and inspection technologies for pharmaceutical and medical device industries. The most popular traditional (usually destructive methods) and current (focuses on the non-destructive approaches) technologies will be introduced and compared. The talk will also give some brief about major technologies that PTI are carrying now. Finally, the current and future challenges in this demanding field will be addressed.

Speaker(s): Dr. Wenliang Chen,


Dr. Wenliang Chen is a Principle Application Engineer/Quality Manager at PTI, supporting the research and development team as well as the manufacturing and production departments. Her expertise and research focus have primarily been air-borne ultrasound Seal-Scan® technology, vacuum decay test method development specific to package integrity testing, as well as developing new inspection technologies. In the past years, she has provided timeless support to customer and local agent offices primarily in Asian and European global markets. Dr. Wenliang Chen received her Ph.D. in Mechanical Engineering from the New Jersey Institute of Technology in 2012. After graduation, she worked five years in the center of Engineering Particulates as a Research Associate in NJIT. Prior to joining NJIT, she was an Assistant Professor at Shanghai Jiaotong University.

Bldg: Auditorium M105, Muscarelle Center
Fairleigh Dickinson University
Teaneck, New Jersey


March 23, 2017
12:00 pm - 1:00 pm



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