2.5D and 3D Heterogeneous Integration Architectures using Dense Electrical, Photonic, and Embedded Cooling technologies for the Next Phase of Moore’s Law

Albany, New York, United States, Virtual: https://events.vtools.ieee.org/m/276503 Albany, New York, United States, Virtual: https://events.vtools.ieee.org/m/276503

Monolithic ICs have progressed at an unprecedented rate of innovation in the past 60 years. But, with Moore’s Law slowing down, ‘polylithic' integration of heterogeneous ICs and devices is projected... Read more

IEEE Senior Member Grade Elevation Night

Buffalo, New York, United States, Virtual: https://events.vtools.ieee.org/m/276805 Buffalo, New York, United States, Virtual: https://events.vtools.ieee.org/m/276805

You are invited to an important event – an opportunity to apply for IEEE Senior Member grade!You will learn about filling out the application and obtaining sponsorship for you application.All... Read more

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