Chiplet Design and Heterogeneous Integration Packaging

SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 950335, Virtual: https://events.vtools.ieee.org/m/336549

Performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking geometries, more complex 3-dimensional structures, and new materials. High temperatures, hot spots and temperature spikes can have a... Read more

Towards Low-Power and Internet-Scale Mixed Reality

Room: The Lewis P. and Julia Kiernan Conference Room, Bldg: Electrical and Computer Engineering Center Suite 200, New Jersey Institute of Technology, University Heights, Newark, New Jersey, United States, 07102, Virtual: https://events.vtools.ieee.org/m/349644

Low power consumption and scalability are the key properties of augmented reality (AR) yet to be realized to attract more users and drive new applications. Towards low-power single-user AR, we... Read more

March Section Meeting – New Venue Trial

415 NJ-18 #19, East Brunswick, New Jersey, United States, 08816

This event is the Section Meeting for the NJ Coast Executive Committee Meeting. This meeting will be In Person at a New Venue in East Brunswick.Venue:SOFRA's Turkish Restaurant415 NJ-18 #19East... Read more

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