Heterogeneous Integration to enable AI Architectures

Room: GOL-2400, Bldg: Golisano Hall (Computing), Rochester Institute of Technology, Rochester, New York, United States, 14623

Abstract:While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures... Read more

ASEE Student Research Conference

University Park, State College, PA, College Town, Pennsylvania, United States, 16802

The Buffalo State IEEE student branch traveled down to the ASEE zone 1 conference at Penn State to present posters on their various projects. Two of the teams won awards... Read more

Through-Hole Soldering Workshop (The Sequel!)

Room: 190, Bldg: ETEC, 1400 Washington Avenue, University at Albany, Albany, New York, United States, 12222

A beloved sequel to our previous through-hole soldering workshop hosted by Amanda Berryman. This workshop will also feature a tutorial with PCB boards but have easier boards, so it'll be... Read more

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