FREE Webinar The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied to the BGA device beyond just the thermal expansion mismatch. This presentation will... Read more
Take a deeper look into the physics, environmental, and material science impacts associated with the different types of connectors used in a substation. This presentation will review the various types of connectors, when they are used, and their various characteristics. Co-sponsored by: Orbital Engineering Speaker(s): Jeff Zelinski, PE, Virtual: https://events.vtools.ieee.org/m/343760
Take a deeper look into the physics, environmental, and material science impacts associated with the different types of connectors used in a substation. This presentation will review the various types of connectors, when they are used, and their various characteristics. Co-sponsored by: Orbital Engineering Speaker(s): Jeff Zelinski, PE, Virtual: https://events.vtools.ieee.org/m/343760
