Webinar – BGA Reliability and Manufacturing Challenges
Virtual: https://events.vtools.ieee.org/m/337840FREE Webinar The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied to the BGA device beyond just the thermal expansion mismatch. This presentation will... Read more