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Heterogeneous Integration to enable AI Architectures

Room: GOL-2400, Bldg: Golisano Hall (Computing), Rochester Institute of Technology, Rochester, New York, United States, 14623

Abstract:While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures... Read more →

ASEE Student Research Conference

University Park, State College, PA, College Town, Pennsylvania, United States, 16802

The Buffalo State IEEE student branch traveled down to the ASEE zone 1 conference at Penn State to present posters on their various projects. Two of the teams won awards... Read more →

Through-Hole Soldering Workshop (The Sequel!)

Room: 190, Bldg: ETEC, 1400 Washington Avenue, University at Albany, Albany, New York, United States, 12222

A beloved sequel to our previous through-hole soldering workshop hosted by Amanda Berryman. This workshop will also feature a tutorial with PCB boards but have easier boards, so it'll be... Read more →

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