New Directions and Challenges in the Packaging of AR/VR Hardware

SEMI World Hdqtrs, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/347031

This presentation will focus on the new trajectory for Si packaging technology set by the emergence of AR/VR hardware and advanced wearable computing. We believe the next major step beyond... Read more

IEEE Syracuse Section ExCom Meeting – April 7 2023

Room: 2-202 , Bldg: Center for Science and Technology, Syracuse University, Syracuse, New York, United States, 13244, Virtual: https://events.vtools.ieee.org/m/356061

Monthly Executive Committee MeetingSyracuse ExcomFriday, April 7, 202312:00 PM | (UTC-05:00) Eastern Time (US & Canada) | 2 hrsMeeting number 2533 921 4631Meeting password: Ynnv45WsuN3Meeting URL: (https://linkprotect.cudasvc.com/url?a=https%3a%2f%2fna01.safelinks.protection.outlook.com%2f%3furl%3dhttps%253A%252F%252Fieeemeetings.webex.com%252Fieeemeetings%252Fj.php%253FMTID%253Dmd244cd2cc13e28332673460318ac104a%26data%3d05%257C01%257C%257Cfcc6c28b98264635001b08db3075343d%257C84df9e7fe9f640afb435aaaaaaaaaaaa%257C1%257C0%257C638157052161107079%257CUnknown%257CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%253D%257C3000%257C%257C%257C%26sdata%3dRomSvwSJUb%252F%252FcvEFD75kZ%252BW0uQcIFpIE0GljjuexevU%253D%26reserved%3d0&c=E,1,WXqbdbwEUpqtXkgpN80GtFoGbXBFqusbVk_s_f2szaw7GTH9unYQNKHLynmgE2UfOF3u8H4pDIRD2Ld-IGyMSUnstMc0cSFkdQQyNf_Jyw,,&typo=1)Room: 2-202 , Bldg:... Read more

Invited Talk: Dr. Allen G. Morinec

storrs, Connecticut, United States

High Power Electronics – HVDC Lines and FACTS Devices (SVC/STATCOM)The theory and application of semiconductor devices and systems to the control of high-voltage DC and AC transmission and distribution systems... Read more

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