Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity
Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity
Various speakers will give talks on advanced technologies for inter-chiplet connectivitySpeaker(s): Various speakers, Agenda: Vineet Pancholi, Sr Director, Test Technology, Amkor Technology, Inc., Topic: Advanced Technologies for Inter- Chiplet ConnectivityDr. Ning-Cheng Lee , ShinePure Hi-Tech, Topic: Material Considerations for high Reliability Pb-Free Solder JointsDr. Tanja Braun, Fraunhofer IZM, Dept. System Integration and Interconnection Technologies, Topic:... Read more