Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temperature RF and Photonics Packaging
Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temperature RF and Photonics Packaging
Key topics included in this talk are the latest advancements in 3D antennas and RF/photonic packaging, focusing on cutting-edge Advanced Manufacturing (AM) processes such as micro-dispensing, two-photon polymerization, femtosecond laser machining, and aerosol jetting. These processes are crucial for developing high-performance wireless hardware for highly specialized low-volume space applications. Additionally, the seminar will explore aerospace-grade materials, emphasizing their electromagnetic and mechanical properties that ensure compatibility with space conditions. Finally, the talk will present practical examples of RF/photonic packaging and 3D conformal metasurface antennas, highlighting their potential to revolutionize space communications. Attendees will gain insights into the future directions of wireless technologies in the space industry and the innovative solutions driving this exciting frontier. Co-sponsored by: IEEE North Jersey Section Speaker(s): Dr. Eduardo A. Rojas-Nastrucci Virtual: https://events.vtools.ieee.org/m/429821