Week of Events
2D Materials for Next-Generation Electronics: From Low-Power Logic to Monolithic Memory
2D Materials for Next-Generation Electronics: From Low-Power Logic to Monolithic Memory
Silicon has been the dominant material for electronic computing for decades, but it is well-known that Moore’s law is long dead. Therefore, a fervent search for (i) new semiconductors that could directly replace silicon or (ii) new architectures with novel materials/devices added onto silicon or (iii) new physics/state-variables or a combination of above has been the subject of much of the electronic materials and devices research of the past 2 decades. This is not possible without fundamental innovation in new electronic materials and devices. Therefore, I will make the case that novel layered two-dimensional (2D) chalcogenide materials and three-dimensional (3D) nitride materials might present interesting avenues to overcome some of the limitations being faced by Silicon hardware. I will present our work on integration of 2D chalcogenide semiconductors with Silicon to realize low-power tunnelling field effect transistors. In particular I will focus on In-Se based 2D semiconductors for this application and extend discussion on them to phase-pure, epitaxial thin-film growth over wafer scales, at temperatures low-enough to be compatible with back end of line (BEOL) processing in Silicon fabs. I will then discuss memory devices from 2D materials when integrated with emerging wurtzite structure ferroelectric nitride materials namely aluminium scandium nitride (AlScN). First, I will present on Ferroelectric Field Effect Transistors (FEFETs) made from 2D materials when integrated with AlScN and make the case for 2D semiconductors in this application. Next I will introduce our work on Ferroelectric Diode (FeD) devices also based on thin AlScN. I will also present how FeDs provide a unique advantage in compute-in-memory (CIM) architectures for efficient storage, search and hardware implementation of neural networks. Finally, I will present ongoing work and opportunities to extend the application of AlScN ferrodiodes into extreme environments, scaling them and integration with SiC electronics. I will end the talk with a broad perspective on the role of novel materials and heterostructures in semiconductor technologies for electronic computing. Co-sponsored by: IEEE North Jersey Section Speaker(s): , Dr. Deep Jariwala Agenda: Event Time: 2:30 PM to 4:00 PM 2:00 PM Refreshments and Networking 2:15 PM Talk by Dr. Deep Jariwala of U Penn Seminar is in Central King Building, Room 116. All Welcome: There is no fee/charge for attending IEEE technical seminar. You don't have to be an IEEE Member to attend. Refreshments are free for all attendees. Please invite your friends and colleagues to take advantage of this Invited Distinguished Lecture. Room: 116, Bldg: Central King Building, 154 Summit Street, Newark, NJ 07102, NJIT, Newark, New Jersey, United States, 07102
Developing Game Worlds
Developing Game Worlds
Welcome to our virtual guest lecture on the topics of game development and level designing by Zain Shahbaz! Below is a brief summary of the topics in the presentation: In this presentation, I will provide an introductory overview of game development and level designing, focusing on the fundamentals. Topics include the game development process, the role and importance of level design, key principles for creating engaging levels, Unity’s tools and workflows for level design, and a demo to demonstrate building a simple level within Unity. I will also share tips, common challenges for beginners, and resources to help them get started on their journey. Speaker(s): Zain Shahbaz Virtual: https://events.vtools.ieee.org/m/446659
Digital Engineering 101
Digital Engineering 101
Please attend the North Jersey Systems council as we welcome Distinguished lecturer Tom MeDermott as he will give a talk on Digital Engineering 101. Speaker(s): Tom, Room: M105, Bldg: Muscarellel, 1000 River Rd., Teaneck, New Jersey, United States, 07666, Virtual: https://events.vtools.ieee.org/m/445515
Power and URD Cable, Overhead Cable Systems & Molded Products – Marmon Utility
Power and URD Cable, Overhead Cable Systems & Molded Products – Marmon Utility
Key areas of discussion: - Power and URD Cable - Overhead Cable Systems - Molded Products - Marmon Utility, LLC is owned by and has the full backing of Berkshire Hathaway. - Marmon Utility, LLC is comprised of Hendrix Overhead, Hendrix Molded, Hendrix Power Cable, Kerite Power Cable, and Kerite Cable Services. - Marmon Utility, LLC product breadth includes both distribution and transmission voltages with 200 years of reliable support to the electric utility industry. - All Marmon products manufactured in United States. Speaker(s): Adam, Scott , Edward Agenda: The seminar fee includes lunch, refreshments and handouts. Non-members joining IEEE within 30 days of the seminar will be rebated 50% of the IEEE registration charge. Four hours of instruction will be provided. If desired, IEEE Continuing Education Units (0.4 CEUs) will be offered for this course - a small fee of $55 will be required for processing. Please pay attention to the “Registration Fee” and choose the appropriate choice either with or without CEUs. CEU Evaluation Form can be found at: (https://innovationatwork.ieee.org/ieee-pes-northjersey-certificates/) At this time, our attendance is being limited to fifty (50). Please only register if you know you are going to attend, and you must be registered to participate. Room: Auditorium, Bldg: PSE&G - Hadley Road Facility, 4000 Hadley Road, South Plainfield, New Jersey, United States, 07080
Toward Trustworthy AI/ML in 6G Networks through Explainable Reasoning
Toward Trustworthy AI/ML in 6G Networks through Explainable Reasoning
Special Presentation by Dr. Farhad Rezazadeh (CTTC, Spain) Hosted by the Future Networks Artificial Intelligence & Machine Learning (AIML) Working Group Date/Time: Thursday, November 21st, 2024 @ 12:00 UTC Topic: Toward Trustworthy AI/ML in 6G Networks through Explainable Reasoning Abstract: This talk emphasizes the importance of trustworthy Artificial Intelligence (AI) in 6G networks in response to growing global attention on AI governance. Notable initiatives such as the White House's Executive Order on the Safe, Secure, and Trustworthy Development and Use of AI, DARPA's Assured Neuro-Symbolic Learning and Reasoning and eXplainable AI (XAI) programs, and the European Union's AI Act, highlight the increasing regulatory focus on AI transparency and responsibility. As 6G networks transition from AI-native to automation-native, the need for explainability and trustworthiness becomes critical, especially in mission-critical and high-stakes applications. Traditional post-hoc explainability methods, which aim to explain AI decisions after they are made, are no longer adequate in complex network environments. Instead, in-hoc explainability or explanation-guided techniques – where explanations guide the learning process itself – is emerging as a crucial approach for establishing trust in AI systems from the ground up. Indeed, integrating explanatory mechanisms directly within AI learning models enables transparent decisions and enhances learning. Furthermore, incorporating neuro-symbolic approaches, which combine neural networks with symbolic reasoning, provides a robust framework to tackle the increasing complexity of 6G networks. By integrating these approaches, AI systems can make more explainable, contextually guided decisions, boosting trust and performance while mitigating risks associated with black-box AI models. Speaker: Farhad Rezazadeh received his Ph.D. degree (Excellent Cum Laude) in Signal Theory and Communications from the Technical University of Catalonia (UPC), Barcelona, Spain. He is currently a researcher (Sr. Applied AI Engineer) at the Telecommunications Technological Center of Catalonia (CTTC), Barcelona, Spain. He participated in 8 European and National 5G/B5G/6G R&D projects with leading and technical tasks in the areas of Applied AI. His AI innovation in B5G/6G resource allocation was recognized as a great EU-funded Innovation by the European Commission's Innovation Radar. He was awarded the first patent connected to the H2020 5G-SOLUTIONS project. He was a secondee at NEC Lab Europe and had scientific missions at TUM, Germany, TUHH, Germany, and UdG, Spain. He is a Marie Sklodowska-Curie Ph.D. grantee, winning five different IEEE/IEEE ComSoc grants, two European Cooperation in Science and Technology grants, and a Catalan Government Ph.D. Grant. He is an active member of ACM Professional, IEEE Young Professionals, and IEEE Spain - Technical Activities and Standards, with more than 29 top-tier journals/conferences and book chapters. He actively serves as Organizing, Chair, Reviewer, and TPC member in IEEE and Guest Editor for Elsevier. He has over 140 verified reviews for peer-reviewed publications. He coordinates the IEEE Trustworthy Internet of Things (TRUST-IoT) working group within the IEEE IoT Community. Co-sponsored by: Toward Trustworthy AI/ML in 6G Networks through Explainable Reasoning Virtual: https://events.vtools.ieee.org/m/443359
Empowering Connectivity: Wearable Antennas for WiFi and 5G Applications – AP-S DL Talk
Empowering Connectivity: Wearable Antennas for WiFi and 5G Applications – AP-S DL Talk
(https://events.vtools.ieee.org/m/447098) []IEEE AP-S DL Talk by Dr. Sima Noghanian Co-Sponsored by: AP/MTT Jt. Chapter, IEEE Kingston Section AP/MTT Jt. Chapter, IEEE North Jersey Section Event Hosts contact emails: Ajay Poddar, Email: [email protected] Anisha Apte, Email: [email protected] Jawad Siddiqui: [email protected] Yahia Antar: [email protected] Co-sponsored by: AP/MTT Jt. Chapter, IEEE Kingston Section Speaker(s): Dr. Sima Noghanian, Agenda: AP-S DL Talk: Title: Empowering Connectivity: Wearable Antennas for WiFi and 5G Applications Dr. Sima Noghanian CommScope Ruckus Networks Sunnyvale, California, USA [email protected] Day, Date, Time: Friday, Nov.22, 2024, 11:30 AM-1:30 PM Hosts: AP/MTT Jt. Chapter, IEEE Kingston Section AP/MTT Jt. Chapter, IEEE North Jersey Section Virtual: https://events.vtools.ieee.org/m/447098
Noise in Oscillators with Active Inductors
Noise in Oscillators with Active Inductors
(https://www.radioclubofamerica.org/content.aspx?page_id=4002&club_id=500767&item_id=2319122) Co-sponsored by: IEEE North Jersey Section Speaker(s): Dr. Ulrich Rohde Agenda: (https://www.radioclubofamerica.org/content.aspx?page_id=4002&club_id=500767&item_id=2319122) Date and Time: Saturday, November 23, 2024, 8:00 AM until 10:00 PM Location Westin Times Square 270 W 43rd St New York, NY 10036 USA (http://maps.google.com/maps?q=270%20W%2043rd%20St,New%20York,NY,10036,USA) Technical Symposium + Awards Banquet BUNDLE Registration Registration Types & Fees: Non-Member US$ 300.00 Member US$ 230.00 Member Guest US$ 230.00 Member with Non-Member Guest US$ 230.00 Non-Member Guest US$ 300.00 Bldg: Westin Times Square, 270 W 43rd St, New York, New Jersey, United States, 10036
Photonics for National Defense
Photonics for National Defense
Photonics is the key technology that is enabling the current 4th industrial revolution. It plays a vital role in our everyday life and everywhere around us. Photonics is revolutionizing defense technologies to protect national assets. It allows warfighters to remain informed about their situational awareness, aiming, firing, range measurements, and safety during operations through optical sensors, reliable and secure communication, and electronic warfare (EW). Photonics provides highly accurate and reliable ways to detect and neutralize threats. This talk will give a broad overview of some photonics applications specific to defense to create an awareness of the importance of photonics. (https://www.radioclubofamerica.org/content.aspx?page_id=4002&club_id=500767&item_id=2319122) Co-sponsored by: IEEE North Jersey Section Speaker(s): Dr. Naresh Chand Agenda: (https://www.radioclubofamerica.org/content.aspx?page_id=4002&club_id=500767&item_id=2319122) Date and Time: Saturday, November 23, 2024, 8:00 AM until 10:00 PM Location Westin Times Square 270 W 43rd St New York, NY 10036 USA (http://maps.google.com/maps?q=270%20W%2043rd%20St,New%20York,NY,10036,USA) Technical Symposium + Awards Banquet BUNDLE Registration Registration Types & Fees: Non-Member US$ 300.00 Member US$ 230.00 Member Guest US$ 230.00 Member with Non-Member Guest US$ 230.00 Non-Member Guest US$ 300.00 Bldg: Westin Times Square, 270 W 43rd St, New York, New York, United States, 10036