Year | Recipient | Category | Award Inscription | |
2022 | Santosh Kurinec | The William Terry Distinguished Service Award | For IEEE service, and outstanding research and teaching semiconductor technology and promoting semiconductor workforce generation | |
2019 | J. Yang Shanchieh | Outstanding Teaching in an IEEE Area of Interest (University or College) | For outstanding leadership and contributions to cybersecurity and computer engineering education | |
2018 | Cristian A. Linte | 3D - Outstanding Teaching in an IEEE Area of Interest (University or College) | For contributions to the biomedical engineering profession and to educating and training future generation of engineers, in particular, to the field of medical image computing, modeling, and visualization for computer-aided diagnosis and image-guided surgery | |
2018 | Jiebo Luo | 3A - Technological Innovation (Academic) | For contributions in computer vision and data mining | |
2016 | Alexander C. Loui | 3B - Technological Innovation (Industry or Government) | For significant contributions and technical leadership in multimedia and computer vision algorithms research and development | |
2016 | Wendi B. Heinzelman | 3E - Outstanding Teaching in an IEEE Area of Interest (Pre-University or College) | For outstanding support and leadership of the University of Rochester IEEE Student Branch | |
2014 | Bruce Smith | 3A - Technological Innovation (Academic) | For Significant Technical Advances in the Field of Nanolithography for Semiconductor IC devices. | |
2014 | Greg Gdowski | 3A - Technological Innovation (Academic) | For Technical Innovation and Leadership in the Fields of Biomedical Engineering and Neurobiology | |
2013 | DeVita, Joseph | 3H - Outstanding Support for the IEEE Mission | For outstanding service to IEEE Rochester Section members and for supporting IEEE pre-college level initiatives | |
2013 | Krispinsky, David | 3H - Outstanding Support for the IEEE Mission | For outstanding service to IEEE Rochester Section and organizational support to the Rochester Engineering Symposium | |
2013 | Mottley, Jack | 3D - Outstanding Teaching in an IEEE area of interest (University or College) | For outstanding teaching excellence in research and design of electrical engineering courses for over thirty-five years | |
2011 | Savakis, Andreas | 3D - Outstanding Teaching in an IEEE area of interest (University or College) | For contributions to education in Computer Engineering and Multimedia | |
2010 | Hsu, Kenneth W. | 3D - Outstanding Teaching in an IEEE area of interest (University or College) | For Oustanding Contributions to Education in Integratd-Circuit Design | |
2010 | Lee, Paul P. | 3B - Technological Innovation (Industry or Government) | For Advancements in CMOS Technology Development for Image Sensors | |
2010 | Pink, Jeffrey R. | 3C - Managerial Excellence in an Engineering Organization | For Managerial Excellence in Design and Manufacturing of Telcommunications Systems | |
2007 | Kendrick, Jean B. | 3H - Outstanding Support for the IEEE Mission | For dedicated service to the IEEE Rochester Section extending over a decade | |
2007 | Venkataraman, Javanti, Dr | 3D - Outstanding Teaching in an IEEE area of interest (University or College) | For developing a unique educational experience in the area of Electromagnetics, Microwaves and Antennas | |
2006 | Derefinko, Victor V. | 1F - Electrical Engineering Support for Student Activities | For outstanding leadership, creativity, hard work, and inspiration in the field of engineering for almost half a century | |
2006 | Schanker, Jacob Z. | 1D - Enhancement of IEEE in Industry and Community Service | For outstanding service and selfless contribution of time and effort to the IEEE Rochester Section and the General Rochester Engineering Community | |
2006 | Stoffel, James C., Dr. | 1E - Electrical Engineering Management | For excellence in management and technical leadership in the field of Imaging Systems | |
1994 | Stratton, John | 1D - Enhancement of IEEE in Industry and Community Service | For outstanding service to IEEE and to the Rochester Community | |