Calendar of Events
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IEEE Rochester Section ExCom Meeting – March 2023
IEEE Rochester Section ExCom Meeting – March 2023
The monthly Rochester IEEE Executive Committee meeting brings together all of the leaders of the Section, Chapters, and Groups. ExCom members: Please send your updates on past and upcoming events to the (mailto:roc.sec.chair@ieee.org) to be included on the agenda prior to the meeting. We review plans for upcoming Rochester meetings within our Section, Chapters, and groups at this meeting. If you are looking to become more engaged in IEEE in the Rochester Section, please plan on attending an Excom meeting! Agenda: - Section Officer Reports - Section Chair Report: (mailto:eric.t.brown@ieee.org) - Section Vice-Chair Report (mailto:Kelly.Robinson@electrostaticanswers.com) - Section Treasurer Report: Emmett Ientilucci - Section Secretary Report: Eric Ziese - Old Business - New Business - Chapter Society and Group Reports - Aerospace and Electronic Systems Society and Communications Society (AES10/COMM19) - Computer Society and Computational Intelligence Society (C16/CIS11) - Electron Devices and Circuits and Systems: (mailto:slremc@rit.edu) - Engineering in Medicine and Biology Society (EMB18): (mailto:christian.linte@ieee.org) - Rochester/Binghamton/Buffalo/Ithaca/Syracuse Geoscience and Remote Sensing Society (GRS29): (mailto:emmett@cis.rit.edu) - Life Members Group: (mailto:m.schrader@ieee.org) - Microwave Theory and Techniques Society / Antennas and Propagation Society (MTT17/AP03): (mailto:dwalters710@gmail.com), (mailto:jnveee@rit.edu) - Photonics Society (PHO36): (mailto:bwsemc@rit.edu) and (mailto:pkmohseni@rit.edu) - Power and Energy Society / Industry Applications Society (PE31/IA34): (mailto:Kelly.Robinson@electrostaticanswers.com); (mailto:jeankendrick@ieee.org) - Signal Processing Society (SP01): Eric Zeise - Technology Management Council (TM14): (mailto:ppklee@ieee.org) - Young Professionals: (mailto:eric.t.brown@gmail.com) - Student Chapter Reports: (mailto:m.schrader@ieee.org) - Rochester Institute of Technology: (mailto:jrheee@rit.edu) - University of Rochester: (mailto:minglunlee@rochester.edu) - Committee Reports - Membership Report: (mailto:wmyfowlkes@ieee.org%20) - Awards Report: (mailto:jeankendrick@ieee.org) - Electronic Communications Coordinator: (mailto:chris@fridaypath.com), (mailto:howard@tixlers.com) - Newsletter Report: (mailto:m.schrader@ieee.org) - PACE Report: (mailto:bruceieeerubin@yahoo.com) - E. Liaison Reports - R1 Western Area Chair: (mailto:joseph.s.ott@gmail.com) - Rochester Engineering Society (RES) Report: (mailto:greg.gdowski@gmail.com) - Rochester Council of Scientific Societies (RCSS) Report: (mailto:wabrewer@ieee.org) - Open Discussion - Adjournment Bldg: Tandoor of India, 376 Jefferson Rd, Rochester, New York, United States, 14623, Virtual: https://events.vtools.ieee.org/m/342657
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Career Talk with Kelly Robinson
Career Talk with Kelly Robinson
UR IEEE is hosting Rochester electrical engineer Kelly Robinson on Tuesday, March 14th from 5-6pm in Computer Studies Building 523. He will be talking about his time at Kodak and his experience starting his own business. We hope to see everyone there! Room: 523, Bldg: Computer Studies Building, 120 Trustee Road, Rochester, New York, United States, 14620
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Heterogeneous Integration to enable AI Architectures
Heterogeneous Integration to enable AI Architectures
Abstract: While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology, especially Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration. We will look at their attributes as well as their challenges, to determine how they can be leveraged to achieve AI architectures. Speaker(s): Mukta Farooq, Agenda: 12:00 noon: pizza is served 12:15PM: talk begins 1PM: Q&A, discussion, refreshments Room: GOL-2400, Bldg: Golisano Hall (Computing), Rochester Institute of Technology, Rochester, New York, United States, 14623
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