IEEE Rochester Section ExCom Meeting – April 2025

Bldg: Tandoor of India, Rochester, New York, United States, 14623, Virtual: https://events.vtools.ieee.org/m/468634

The monthly Rochester IEEE Executive Committee meeting brings together all of the leaders of the Section, Chapters, and Groups. ExCom members: Please send your updates on past and upcoming events to the (mailto:roc.sec.chair@ieee.org) to be included on the agenda prior to the meeting. We review plans for upcoming Rochester meetings within our Section, Chapters, and groups at this meeting. If you are looking to become more engaged in IEEE in the Rochester Section, please plan on attending an Excom meeting! Agenda: - Section Officer Reports - Section Chair Report: (mailto:Kelly.Robinson@electrostaticanswers.com) - Section Vice-Chair Report: (mailto:Emmett@cis.rit.edu) - Section Treasurer Report: (mailto:ekzeise@IEEE.ORG) - Section Secretary Report: (mailto:ekzeise@IEEE.ORG) - Old Business - New Business - Chapter Society and Group Reports - Aerospace and Electronic Systems Society and Communications Society (AES10/COMM19); (mailto:nxsvks@rit.edu) - Computer Society and Computational Intelligence Society (C16/CIS11); (mailto:cemeec@rit.edu) - Electron Devices and Circuits and Systems: (mailto:slremc@rit.edu) - Engineering in Medicine and Biology Society (EMB18): (mailto:christian.linte@ieee.org) - Rochester/Binghamton/Buffalo/Ithaca/Syracuse Geoscience and Remote Sensing Society (GRS29): (mailto:emmett@cis.rit.edu) - Life Members Group: (mailto:m.schrader@ieee.org); (mailto:jeankendrick@ieee.org) - Microwave Theory and Techniques Society / Antennas and Propagation Society (MTT17/AP03): (mailto:dwalters710@gmail.com), (mailto:jnveee@rit.edu) - Photonics Society (PHO36): (mailto:pkmohseni@rit.edu) - Power and Energy Society / Industry Applications Society (PE31/IA34): (mailto:Kelly.Robinson@electrostaticanswers.com); (mailto:jeankendrick@ieee.org) - Signal Processing Society (SP01): (mailto:ekzeise@ieee.org) - Technology Management Council (TM14): (mailto:ppklee@ieee.org) - Women In Engineering (WIE): (mailto:deyasini.majumdar@ieee.org) - Young Professionals: (mailto:eric.t.brown@gmail.com) - Student Chapter Reports: (mailto:m.schrader@ieee.org) - Rochester Institute of Technology: (mailto:jrheee@rit.edu) - University of Rochester: (mailto:minglunlee@rochester.edu) - Committee Reports - Membership Report: (mailto:wmyfowlkes@ieee.org%20) - Awards Report: (mailto:jeankendrick@ieee.org) - Electronic Communications Coordinator: (mailto:eric.t.brown@gmail.com) - Newsletter Report: (mailto:m.schrader@ieee.org) - E. Liaison Reports - R1 Western Area Chair: (mailto:Emmett@cis.rit.edu) - Rochester Engineering Society (RES) Report: (mailto:Kelly.Robinson@electrostaticanswers.com) - Open Discussion - Adjournment Bldg: Tandoor of India, Rochester, New York, United States, 14623, Virtual: https://events.vtools.ieee.org/m/468634

43rd Annual Microelectronic Engineering Conference at RIT

Room: 2210 - 2240, Bldg: CIMS / Slaughter Hall SLA/078 (campus map), Rochester Institute of Technology, One Lomb Memorial Drive, Rochester, New York, United States, 14623

(https://events.vtools.ieee.org/event/register/474822) This conference brings together students, faculty, alumni, friends and industry guests interested in Microelectronic Engineering. Key elements of the conference are: technical presentations by seniors on their capstone research and design projects, industry and alumni presentations, recognition of companies who have supported the program, review of program activities and achievements over the past year and industry feedback on student and academic program activities. The event begins on Monday evening with a reception and dinner at the RIT Inn & Conference Center. The reception starts at 5:30pm, with dinner at 6:30pm and speakers to follow. (https://maps.rit.edu/?details=RIT+Inn+&+Conference+Center) The technical session is on Tuesday from 8am - 4pm in the Center for Integrated Manufacturing (CIMS, SLA/078). (https://maps.rit.edu/?details=CIMS+Conference+Center) Registration is required (no charge) to determine meal orders. Speaker(s): David Coumou , Carlos Fonseca, Bruce Smith, Mark Indovina, Daniel Morvay Agenda: Monday April 14, 2025 5:30 p.m. Reception at the RIT Inn and Conference Center Dinner Agenda 6:30 p.m. Dinner Begins 7:00 p.m. Program Begins Welcome by Dr. Karl Hirschman, Micron Professor, Microelectronic Engineering Program Director “Microelectronic Engineering – The Year in Review”, Dr. Robert Pearson, Past Director of the Microelectronic Engineering Program Awards: Dr. Renan Turkman Scholarship Award Announcement Dr. Lynn Fuller Scholarship Award Announcement Closing Remarks: Dr. Karl Hirschman Tuesday April 15, 2025 8:00 – 8:30 a.m. Registration CIMS Technical Program Agenda Morning Session AM-1 Session Chair: Dr. Robert Pearson, Associate Professor 8:30 a.m. Welcome: Karl Hirschman, Microelectronic Engineering Program Director 8:35 a.m. Opening Remarks: Dean Doreen Edwards, Kate Gleason College of Engineering 8:40 a.m. “Plasma Science and Engineering for Semiconductor Processing“, David Coumou (RIT BSEE ’92, MSEE ‘01), Managing Director, Core R&D at Applied Materials (AMAT) 9:10 a.m. S-1 “Reactive Sputtering of Aluminum Scandium Nitride”, Ryan Allen, Senior MicroE ‘25 9:30 am S-2 “Titanium Nitride Process Development for Gate Electrode in Thin Film Transistors”, Kyle Legg, Senior MicroE ‘25 9:50 a.m. BREAK and Posters Morning Session AM-2 Session Chair: Dr. Karl Hirschman, Micron Professor 10:20 a.m. "The Role of “Digital” in Semiconductor Manufacturing Equipment Applications", Carlos Fonseca (RIT MicroE BS ’99), Senior Director, Technology at Tokyo Electron (TEL) 10:50 a.m. S-3 “Silicon Carbide Device and Process Design at RIT”, Abby Mizgala, Senior MicroE ‘25 11:10 a.m. S-4 “Simplifying Micro-Transfer Printing (µTP): Single-Step Coupon Release Via Metal-Assisted Chemical Etching (MacEtch)”, Steven Johnston, Senior MicroE ‘25 11:30 a.m. “EUV Lithography for 7nm Device Generations and Beyond “, Bruce Smith, Professor Emeritus, RIT 12:00 p.m. LUNCH Afternoon Session PM-1 Session Chair: Sean Rommel, Professor 1:00 p.m. “The VLSI Design Experience”, Mark Indovina (RIT BSEE ’82, MSEE ’87), Senior Lecturer, RIT Electrical and Microelectronic Engineering 1:30 p.m. S-5 " Investigation of Carry-Select Adder Low Power Architectures”, Adheesh Ankolekar, Senior MicroE ‘25 1:50 p.m. S-6 "Cadence Layout and Simulation of an 8-bit 16-Instruction RISC”, Josh Alpert, Senior MicroE ‘25 2:10 p.m. BREAK and Posters Afternoon Session PM-2 Session Chair: Michael Jackson, Associate Professor 3:00 p.m. “Overview of the “UPWARDS for the Future” Program, Parsian K. Mohseni, Associate Professor, Department of Electrical and Microelectronic Engineering 3:10 p.m. "Real Cost of Compute: From Edge to Quantum", Daniel Morvay (RIT MicroE BS ’91), Principal Research Scientist, AI & Big Data Leader at Tokyo Electron (TEL) 3:40 p.m. "Improving the Performance Variation for Graphene-Based Field-Effect Transistor”, Andrew Spencer, Senior MicroE ‘25 4:00 p.m. Technical Session Closing Remarks - Dr. Karl Hirschman Conference Adjourn – see you in 2026! Room: 2210 - 2240, Bldg: CIMS / Slaughter Hall SLA/078 (campus map), Rochester Institute of Technology, One Lomb Memorial Drive, Rochester, New York, United States, 14623

IEEE Rochester Section ExCom Meeting – May 2025

Bldg: Tandoor of India, Rochester, New York, United States, 14623, Virtual: https://events.vtools.ieee.org/m/479006

The monthly Rochester IEEE Executive Committee meeting brings together all of the leaders of the Section, Chapters, and Groups. ExCom members: Please send your updates on past and upcoming events to the (mailto:roc.sec.chair@ieee.org) to be included on the agenda prior to the meeting. We review plans for upcoming Rochester meetings within our Section, Chapters, and groups at this meeting. If you are looking to become more engaged in IEEE in the Rochester Section, please plan on attending an Excom meeting! Agenda: - Section Officer Reports - Section Chair Report: (mailto:Kelly.Robinson@electrostaticanswers.com) - Section Vice-Chair Report: (mailto:Emmett@cis.rit.edu) - Section Treasurer Report: (mailto:ekzeise@IEEE.ORG) - Section Secretary Report: (mailto:ekzeise@IEEE.ORG) - Old Business - New Business - Chapter Society and Group Reports - Aerospace and Electronic Systems Society and Communications Society (AES10/COMM19); (mailto:nxsvks@rit.edu) - Computer Society and Computational Intelligence Society (C16/CIS11); (mailto:cemeec@rit.edu) - Electron Devices and Circuits and Systems: (mailto:slremc@rit.edu) - Engineering in Medicine and Biology Society (EMB18): (mailto:christian.linte@ieee.org) - Rochester/Binghamton/Buffalo/Ithaca/Syracuse Geoscience and Remote Sensing Society (GRS29): (mailto:emmett@cis.rit.edu) - Life Members Group: (mailto:m.schrader@ieee.org); (mailto:jeankendrick@ieee.org) - Microwave Theory and Techniques Society / Antennas and Propagation Society (MTT17/AP03): (mailto:dwalters710@gmail.com), (mailto:jnveee@rit.edu) - Photonics Society (PHO36): (mailto:pkmohseni@rit.edu) - Power and Energy Society / Industry Applications Society (PE31/IA34): (mailto:Kelly.Robinson@electrostaticanswers.com); (mailto:jeankendrick@ieee.org) - Signal Processing Society (SP01): (mailto:ekzeise@ieee.org) - Technology Management Council (TM14): (mailto:ppklee@ieee.org) - Women In Engineering (WIE): (mailto:deyasini.majumdar@ieee.org) - Young Professionals: Looking for a Volunteer! - Student Chapter Reports: (mailto:m.schrader@ieee.org) - Rochester Institute of Technology: (mailto:jrheee@rit.edu) - University of Rochester: (mailto:minglunlee@rochester.edu) - Committee Reports - Membership Report: (mailto:wmyfowlkes@ieee.org%20) - Awards Report: (mailto:jeankendrick@ieee.org) - Electronic Communications Coordinator: (mailto:eric.t.brown@gmail.com) - Newsletter Report: (mailto:m.schrader@ieee.org) - E. Liaison Reports - R1 Western Area Chair: (mailto:Emmett@cis.rit.edu) - Rochester Engineering Society (RES) Report: (mailto:Kelly.Robinson@electrostaticanswers.com) - Open Discussion - Adjournment Bldg: Tandoor of India, Rochester, New York, United States, 14623, Virtual: https://events.vtools.ieee.org/m/479006

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